ASE 40th Anniversary
To celebrate our 40th anniversary, we collaborated with emerging local artists to create a film showcasing our milestones, achievements, and ambitions for the future.
Satellite Communications
ASE innovates advanced packaging to deliver its Satellite Communication SiP Module to the global communications market.
FOCoS-Bridge
ASE VIPack™ FOCoS-Bridge integrates multiple ASICs and silicon bridges to accelerate AI innovation.
Opening a New Chapter in ASE's Smart Journey
ASE was inducted into the WEF’s Global Lighthouse Network. A prestigious recognition of the company’s strategic adoption of 4IR technologies to successfully raise productivity and shorten customers’ time-to-market.
We’re celebrating our 40th anniversary this year. With more than four decades behind us, we continue to shape the global semiconductor trends and spearhead sustainable digital transformation, advanced packaging, and smart solutions, fostering growth and innovation for a sustainable future.
Technology Leadership
ASE is a primary architect of Heterogeneous Integration (HI)
Our technologies have enabled our customers to create cutting edge products that deliver superior performance, power, speed, and connectivity.
more about HI
Markets Enabled by ASE and Semiconductors
Applications fueled by Semiconductor Innovation
Sustainability Drives the Future
We are building a better world.
Press Center
News
ASE introduces powerSiP™ for transformative power delivery that increases power efficiencies by 50% in AI and data center applications
2024.05.29
News
ASE’s VIPack™ Enables Innovational AI Devices Through Advanced Interconnect Technology for Chiplets
2024.03.20
Technology
AI-Driven Innovation for Manufacturing Automation
2023.12.01
News
ASE wins prestigious Red Dot Design Award
2023.11.10
News
ASE launches its Integrated Design Ecosystem™ to enable silicon package design efficiencies that reduce cycle time by half
2023.10.03
Technology Papers
Patch-type Flex SiP Platform for Heathcare Application
2023.08.03
News
ASE VIPack™ FOCoS-Bridge integrates multiple ASICs and silicon bridges to accelerate AI innovation
2023.05.31
News
ASE wins Device Technology of the Year award for VIPack™
2023.05.02
News
ASE drives latency and bandwidth innovation with VIPack™ Fanout Package-on-Package
2023.03.14
News
ASE’s Bumping Factory in Kaohsiung, Taiwan inducted into the World Economic Forum’s Global Lighthouse Network
2023.01.14
